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Controlled-width track in through silicon via using 3D holographic photolithography with modified electrodepositable photoresist

Toriz-Garcia, Jesus J.; Williams, Gavin L.; McWilliam, Richard; Curry, Richard; Seed, N.L.; Purvis, Alan; Ivey, Peter A.

Authors

Jesus J. Toriz-Garcia

Gavin L. Williams

Richard McWilliam

Richard Curry

N.L. Seed

Peter A. Ivey



Abstract

We present a novel lithographic process for patterning controlled-width tracks onto anisotropically micromachined silicon. The technique is based on the use of computer-generated holographic masks with a custom alignment and exposure tool. Experimental and simulation results are presented. 3D holographic photolithography significantly reduces the problem normally present with photolithography on non-planar surfaces—namely diffractive line broadening. A negative-acting electrodepositable photoresist (InterVia 3D-N) is used in the study. Its deposition onto the 3D substrate is optimized by modification of coating temperature and thickness and of pre-exposure bake conditions. We show the successful patterning of a constant-width 8 µm line down the sloping sidewall of a 500 µm thick silicon wafer. This is beyond the conventional resolution limit and indicates the potential of the technique for realizing high-density vertical routing in electronic packages and MEMS.

Citation

Toriz-Garcia, J. J., Williams, G. L., McWilliam, R., Curry, R., Seed, N., Purvis, A., & Ivey, P. A. (2010). Controlled-width track in through silicon via using 3D holographic photolithography with modified electrodepositable photoresist. Journal of Micromechanics and Microengineering, 20(1), Article 015012. https://doi.org/10.1088/0960-1317/20/1/015012

Journal Article Type Article
Publication Date Jan 1, 2010
Deposit Date Sep 2, 2013
Journal Journal of Micromechanics and Microengineering
Print ISSN 0960-1317
Electronic ISSN 1361-6439
Publisher IOP Publishing
Peer Reviewed Peer Reviewed
Volume 20
Issue 1
Article Number 015012
DOI https://doi.org/10.1088/0960-1317/20/1/015012
Keywords Electronics and devices, Surfaces, interfaces and thin films, Optics, quantum optics and lasers, Nanoscale science and low-D systems.