Šiller, L. and Peltekis, N. and Krishnamurthy, S. and Chao, Y. and Bull, S. J. and Hunt, M. R. C. (2005) 'Gold film with gold nitride-A conductor but harder than gold.', Applied physics letters., 86 (22). p. 221912.
The formation of surface nitrides on gold films is a particularly attractive proposition, addressing the need to produce harder, but still conductive, gold coatings which reduce wear but avoid the pollution associated with conventional additives. Here we report production of large area gold nitride films on silicon substrates, using reactive ion sputtering and plasma etching, without the need for ultrahigh vacuum. Nanoindentation data show that gold nitride films have a hardness ~50% greater than that of pure gold. These results are important for large-scale applications of gold nitride in coatings and electronics.
|Keywords:||Gold, Metallic thin films, Gold compounds, Hardness, Wear resistant coatings, Sputtered coatings, Sputter etching, Indentation.|
|Full text:||PDF - Published Version (145Kb)|
|Publisher Web site:||http://dx.doi.org/10.1063/1.1941471|
|Publisher statement:||© 2005 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Šiller, L. and Peltekis, N. and Krishnamurthy, S. and Chao, Y. and Bull, S. J. and Hunt, M. R. C. (2005) 'Gold film with gold nitride-A conductor but harder than gold.', Applied physics letters., 86 (22). p. 221912 and may be found at http://dx.doi.org/10.1063/1.1941471|
|Record Created:||04 Dec 2006|
|Last Modified:||18 Aug 2015 13:33|
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