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The static and dynamic response of SU-8 electrothermal microgrippers of varying thickness

Dodd, L.E.; Ward, S.C.; Cooke, M.D.; Wood, D.

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Authors

L.E. Dodd

S.C. Ward

D. Wood



Abstract

This work presents an investigation into the effect on dynamic response of SU-8 microgrippers due to varying thickness, and subsequent validation via COMSOL Multiphysics simulations and thermal camera profiling during actuation. The tweezer-like microgrippers can easily manipulate, with a high degree of control, cells and particles with diameters as small as 10 μm, without using an impractical operating voltage or generating excessive heat. However, in order to fully exploit the versatility of the devices, their response characteristics must be fully understood as material and/or dimension parameters change. Therefore an investigation took place to determine the effects of device thickness on functionality of the device, including the drive current required to actuate the gripper and the speed of actuation. Furthermore, an infrared camera was used to characterise the thermal response of the device. Finally, a simulation of the temperature profile and deflection dimension has been developed in order to verify the findings and further investigate and predict the effects of design variations.

Citation

Dodd, L., Ward, S., Cooke, M., & Wood, D. (2015). The static and dynamic response of SU-8 electrothermal microgrippers of varying thickness. Microelectronic Engineering, 145, 82-85. https://doi.org/10.1016/j.mee.2015.03.028

Journal Article Type Article
Acceptance Date Mar 18, 2015
Online Publication Date Mar 25, 2015
Publication Date Sep 1, 2015
Deposit Date Mar 27, 2015
Publicly Available Date Mar 28, 2024
Journal Microelectronic Engineering
Print ISSN 0167-9317
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 145
Pages 82-85
DOI https://doi.org/10.1016/j.mee.2015.03.028
Keywords Microgripper, Electrothermal actuation, SU-8, Simulation, Thermal imaging

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Accepted Journal Article (309 Kb)
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Copyright Statement
NOTICE: this is the author’s version of a work that was accepted for publication in the Journal of microelectronic engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in the Journal of microelectronic engineering, 145, 2015, 10.1016/j.mee.2015.03.028




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