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Modelling and Experimental Verification of Heat Dissipation Mechanisms in an SU-8 Electrothermal Microgripper

Solano, B.; Merrell, J.; Gallant, A.J.; Wood, D.

Modelling and Experimental Verification of Heat Dissipation Mechanisms in an SU-8 Electrothermal Microgripper Thumbnail


Authors

B. Solano

J. Merrell

D. Wood



Abstract

Within this work, a microgripper based on a hot–cold arm principle was tested to give a greater understanding of the associated heat dissipation methods. Experiments were conducted in air at atmospheric and sub-atmospheric pressure, and in helium, argon and helium at sub-atmospheric pressure. The change in deflection, when using gases with different thermal conductivities and at varying pressures showed the significance of conduction through the atmosphere. The experimental results were found to verify a theoretical model created previously by this group, and a further model developed independently; both predicted the deflection that a given current would cause.

Citation

Solano, B., Merrell, J., Gallant, A., & Wood, D. (2014). Modelling and Experimental Verification of Heat Dissipation Mechanisms in an SU-8 Electrothermal Microgripper. Microelectronic Engineering, 124, 90-93. https://doi.org/10.1016/j.mee.2014.06.002

Journal Article Type Article
Acceptance Date Jun 2, 2014
Publication Date Jul 25, 2014
Deposit Date Apr 10, 2015
Publicly Available Date Mar 29, 2024
Journal Microelectronic Engineering
Print ISSN 0167-9317
Publisher Elsevier
Peer Reviewed Peer Reviewed
Volume 124
Pages 90-93
DOI https://doi.org/10.1016/j.mee.2014.06.002
Keywords Microgripper, Heat dissipation, Thermal imaging, Electrothermal, SU-8.

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Copyright Statement
NOTICE: this is the author’s version of a work that was accepted for publication in Microelectronic Engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Microelectronic Engineering, 124, 25 July 2014, 10.1016/j.mee.2014.06.002.





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