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Manipulation of exposure dose parameters to improve production of high aspect ratio structures using SU-8

Daunton, R; Gallant, AJ; Wood, D

Authors

R Daunton

D Wood



Abstract

The detailed consideration of the chemistry occurring during the fabrication process is very important for SU-8 compared to other photoresists. In SU-8, the solvent does far more than just act as a carrier for the photoactive compounds: it plays a prominent role in the processing chemistry. In this paper we explain how the change of solvent from old to new formulations of SU-8 has an effect on the processing of this resist. We then show how, and why, in the modern 2000 series formulations the manipulation of the polymerization rate via variation of the exposure dose allows dark field features on a mask design to be reduced, in a controlled manner, by up to 30% while still maintaining good sidewall profiles in features.

Citation

Daunton, R., Gallant, A., & Wood, D. (2012). Manipulation of exposure dose parameters to improve production of high aspect ratio structures using SU-8. Journal of Micromechanics and Microengineering, 22(7), Article 075016. https://doi.org/10.1088/0960-1317/22/7/075016

Journal Article Type Article
Publication Date Jan 1, 2012
Deposit Date Oct 5, 2012
Journal Journal of Micromechanics and Microengineering
Print ISSN 0960-1317
Electronic ISSN 1361-6439
Publisher IOP Publishing
Peer Reviewed Peer Reviewed
Volume 22
Issue 7
Article Number 075016
DOI https://doi.org/10.1088/0960-1317/22/7/075016
Keywords Soft matter, liquids and polymers, Electronics and devices, Chemical physics and physical chemistry