Inertial two- and three-dimensional thin film flow over topography

Veremieiev, S.; Thompson, H.M.; Lee, Y.C.; Gaskell, P.H.

doi:10.1016/j.cep.2010.08.008

Inertial two- and three-dimensional thin film flow over topography

Veremieiev, S.; Thompson, H.M.; Lee, Y.C.; Gaskell, P.H.

Authors

Dr Sergii Veremieiev s.veremieiev@durham.ac.uk
Associate Professor

H.M. Thompson

Y.C. Lee

Professor Philip Gaskell p.h.gaskell@durham.ac.uk
Professor

Abstract

The effect of inertia on gravity-driven thin film free-surface flow over substrates containing topography is considered. Flow is modelled using a depth-averaged form of the governing Navier–Stokes equations and the discrete analogue of the coupled equation set solved accurately using an efficient full approximation storage (FAS) and full multigrid (FMG) technique. The free-surface disturbance induced by topographic features is illustrated by considering examples of gravity-driven flow over and around peak, trench and occlusion topography. Results are presented which demonstrate how increasing Reynolds number can significantly enhance the magnitude of free-surface disturbances, a feature which may have important consequences for the wide range of coating process that aim to maximise free-surface planarity.

Citation

Veremieiev, S., Thompson, H., Lee, Y., & Gaskell, P. (2011). Inertial two- and three-dimensional thin film flow over topography. Chemical Engineering and Processing: Process Intensification, 50(5-6), 537-542. https://doi.org/10.1016/j.cep.2010.08.008

Journal Article Type	Article
Acceptance Date	Aug 6, 2010
Online Publication Date	Aug 13, 2010
Publication Date	May 1, 2011
Deposit Date	Jan 26, 2015
Publicly Available Date	Aug 21, 2015
Journal	Chemical Engineering and Processing: Process Intensification
Print ISSN	0255-2701
Publisher	Elsevier
Peer Reviewed	Peer Reviewed
Volume	50
Issue	5-6
Pages	537-542
DOI	https://doi.org/10.1016/j.cep.2010.08.008
Keywords	Coating, Thin film flows, Microfluidics, Topography.

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Copyright Statement
NOTICE: this is the author’s version of a work that was accepted for publication in Chemical Engineering and Processing: Process Intensification. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Chemical Engineering and Processing: Process Intensification, 50, 5-6, May 2011, 10.1016/j.cep.2010.08.008.