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Surface micromachined membranes for wafer level packaging.

Gallant, A. J. and Wood, D. (2005) 'Surface micromachined membranes for wafer level packaging.', Journal of micromechanics and microengineering., 15 (7). S47-S52.


Novel surface micromachined membranes have been developed for wafer level packaging and polymer encapsulation. Laterally unconstrained electroforming allows small etch holes to be included in thick membranes whilst only requiring a thin, low stress, mould. These holes have been shown to have a sufficiently small aperture (<10 µm) and depth (17 µm) to block a high viscosity encapsulant (AZ4562 photoresist). However, they enable the low viscosity sacrificial release etchant (acetone) to pass through. Etch hole inclusion provides a rapid and clean release. In order to route interconnect to the membranes, side port flow channels have been developed which effectively block spin-on encapsulants from entering the protected cavity. The influence of the membranes on the RF performance of micromachined meander inductors is reported.

Item Type:Article
Keywords:Photoresist, MEMS, CHIP.
Full text:Full text not available from this repository.
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Record Created:23 Jan 2007
Last Modified:06 Jun 2017 14:35

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