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In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices.

Tanner, B.K. and Vijayaraghavan, R.K. and Roarty, B. and Danilewsky, A.N. and McNally, P.J. (2019) 'In-Operando X-ray diffraction imaging of thermal strains in fully packaged silicon devices.', Microelectronics reliability., 99 . pp. 232-238.

Abstract

The application of X-ray Diffraction Imaging to measure in operando thermal strains at individually powered components within fully packaged LM3046 silicon devices is described. It is shown that as the local strains increase with power dissipated, above a threshold power loading, the associated region of enhanced X-ray intensity increases monotonically. The changes in contrast in the image are discussed. Asterism in section topographs changes sign as the slit is moved across the component, consistent with lattice strain around the device due to the thermal expansion. Above a threshold power, this asterism increases linearly with power loading. By simultaneous measurement of the package surface temperature it is possible to deduce the local component temperature from the extent of the contrast in the X-ray image.

Item Type:Article
Full text:Publisher-imposed embargo until 27 June 2020.
(AM) Accepted Manuscript
File format - PDF
(690Kb)
Status:Peer-reviewed
Publisher Web site:https://doi.org/10.1016/j.microrel.2019.06.006
Publisher statement:© 2019 This manuscript version is made available under the CC-BY-NC-ND 4.0 license http://creativecommons.org/licenses/by-nc-nd/4.0/
Date accepted:05 June 2019
Date deposited:17 July 2019
Date of first online publication:27 June 2019
Date first made open access:27 June 2020

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