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Condition monitoring for device reliability in power electronic converters : a review.

Yang, S. and Xiang, D. and Bryant, A. and Mawby, P. and Ran, L. and Tavner, P. (2010) 'Condition monitoring for device reliability in power electronic converters : a review.', IEEE transactions on power electronics., 25 (11). pp. 2734-2752.

Abstract

Condition monitoring (CM) has already been proven to be a cost effective means of enhancing reliability and improving customer service in power equipment, such as transformers and rotating electrical machinery. CM for power semiconductor devices in power electronic converters is at a more embryonic stage; however, as progress is made in understanding semiconductor device failure modes, appropriate sensor technologies, and signal processing techniques, this situation will rapidly improve. This technical review is carried out with the aim of describing the current state of the art in CM research for power electronics. Reliability models for power electronics, including dominant failure mechanisms of devices are described first. This is followed by a description of recently proposed CM techniques. The benefits and limitations of these techniques are then discussed. It is intended that this review will provide the basis for future developments in power electronics CM.

Item Type:Article
Keywords:Condition monitoring (CM), Failure mechanism, Fault detection, Power electronics, Prognosis, Reliability.
Full text:Full text not available from this repository.
Publisher Web site:http://dx.doi.org/10.1109/TPEL.2010.2049377
Record Created:09 Nov 2011 15:35
Last Modified:28 Jun 2012 16:53

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