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Interface magnetism in ferromagnetic metal-compound semiconductor hybrid structures

Hindmarch, AT

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Abstract

Interfaces between dissimilar materials present a wide range of fascinating physical phenomena. When a nanoscale thin-film of a ferromagnetic metal is deposited in intimate contact with a compound semiconductor, the properties of the interface exhibit a wealth of novel behavior, having immense potential for technological application, and being of great interest from the perspective of fundamental physics. This article presents a review of recent advances in the field of interface magnetism in (001)-oriented ferromagnetic metal/III–V compound semiconductor hybrid structures. Until relatively recently, the majority of research in this area continued to concentrate almost exclusively on the prototypical epitaxial Fe/GaAs(001) system: now, a significant proportion of work has branched out from this theme, including ferromagnetic metal alloys, and other III–V compound semiconductors. After a general overview of the topic, and a review of the more recent literature, we discuss recent results where advances have been made in our understanding of the physics underpinning magnetic anisotropy in these systems: tailoring the terms contributing to the angular-dependent free-energy density by employing novel fabrication methods and ferromagnetic metal electrodes.

Citation

Hindmarch, A. (2011). Interface magnetism in ferromagnetic metal-compound semiconductor hybrid structures. SPIN, 1(1), 45-69. https://doi.org/10.1142/s2010324711000069

Journal Article Type Article
Publication Date Jan 1, 2011
Deposit Date Aug 24, 2011
Publicly Available Date May 22, 2012
Journal SPIN
Print ISSN 2010-3247
Electronic ISSN 2010-3255
Publisher World Scientific Publishing
Peer Reviewed Peer Reviewed
Volume 1
Issue 1
Pages 45-69
DOI https://doi.org/10.1142/s2010324711000069
Keywords Magnetic anisotropy, Thin-films and interfaces, III–V semiconductors.

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Copyright Statement
Electronic version of an article published as Spin, 1,1, 2011, 45-69, 10.1142/S2010324711000069 © Copyright World Scientific Publishing Company.





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