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Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification

Xiang, D.; Ran, L.; Tavner, P.; Yang, S.; Bryant, A.; Mawby, P.

Authors

D. Xiang

L. Ran

P. Tavner

S. Yang

A. Bryant

P. Mawby



Abstract

Condition monitoring power semiconductor devices can inform converter maintenance and reduce damage. This paper presents a method to monitor solder fatigue in a voltage source inverter insulated gate bipolar transistor power module by detecting the change of an inverter output harmonic. It is shown that low-order harmonics, caused by nonideal switching, are affected by the device junction temperature, which in turn depends upon module solder condition. To improve the detection accuracy of the phenomenon, the inverter controller is set to cause harmonic resonance at the target harmonic frequency. The would-be resonance is suppressed by an outer control loop where the control action can be used as the condition monitoring signal. Simulation and experiment are presented to validate the method and evaluate its performance in operation.

Citation

Xiang, D., Ran, L., Tavner, P., Yang, S., Bryant, A., & Mawby, P. (2012). Condition Monitoring Power Module Solder Fatigue Using Inverter Harmonic Identification. IEEE Transactions on Power Electronics, 27(1), 235-247. https://doi.org/10.1109/tpel.2011.2160988

Journal Article Type Article
Publication Date Jan 1, 2012
Deposit Date Jun 25, 2011
Journal IEEE Transactions on Power Electronics
Print ISSN 0885-8993
Publisher Institute of Electrical and Electronics Engineers
Peer Reviewed Peer Reviewed
Volume 27
Issue 1
Pages 235-247
DOI https://doi.org/10.1109/tpel.2011.2160988
Keywords Condition monitoring, Harmonic, Identification, Insulated gate bipolar transistor (IGBT), Power module, Reliability, Resonance, Solder fatigue.

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