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Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications

Cooke, M.D.; Wood, D.

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Authors

D. Wood



Abstract

Using commercial standard paper as a substrate has a significant cost reduction implication over other more expensive substrate materials by approximately a factor of 100 (Shenton et al 2015 EMRS Spring Meeting; Zheng et al 2013 Nat. Sci. Rep. 3 1786). Discussed here is a novel process which allows photolithography and etching of simple metal films deposited on paper substrates, but requires no additional facilities to achieve it. This allows a significant reduction in feature size down to the micron scale over devices made using more conventional printing solutions which are of the order of tens of microns. The technique has great potential for making cheap disposable devices with additional functionality, which could include flexibility and foldability, simple disposability, porosity and low weight requirements. The potential for commercial applications and scale up is also discussed.

Citation

Cooke, M., & Wood, D. (2015). Fabrication of micron scale metallic structures on photo paper substrates by low temperature photolithography for device applications. Journal of Micromechanics and Microengineering, 25(11), Article 115017. https://doi.org/10.1088/0960-1317/25/11/115017

Journal Article Type Article
Acceptance Date Aug 24, 2015
Online Publication Date Oct 7, 2015
Publication Date Nov 1, 2015
Deposit Date Oct 7, 2015
Publicly Available Date Oct 7, 2016
Journal Journal of Micromechanics and Microengineering
Print ISSN 0960-1317
Electronic ISSN 1361-6439
Publisher IOP Publishing
Peer Reviewed Peer Reviewed
Volume 25
Issue 11
Article Number 115017
DOI https://doi.org/10.1088/0960-1317/25/11/115017

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Accepted Journal Article (534 Kb)
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Copyright Statement
This is an author-created, un-copyedited version of an article published in Journal of Micromechanics and Microengineering. IOP Publishing Ltd is not responsible for any errors or omissions in this version of the manuscript or any version derived from it. The Version of Record is available online at http://dx.doi.org/10.1088/0960-1317/25/11/115017




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