Mr Jonathan Mark Hammler jonathan.hammler@durham.ac.uk
PGR Student Doctor of Philosophy
Simple de-embedding and simulation technique to find permittivity with a THz vector network analyser
Hammler, J.; Gallant, A.J.; Balocco, C.
Authors
Professor Andrew Gallant a.j.gallant@durham.ac.uk
Professor
Professor Claudio Balocco claudio.balocco@durham.ac.uk
Professor
Abstract
A simple and fast method for measuring the dielectric constant with a THz vector network analyser (VNA) has been developed. A numeric de-embedding technique removes free-space propagation effects, then simulation of Maxwell's equations simultaneously fits both permittivity and thickness to measured scattering parameters. Results are presented for semiconductor and dielectric samples within the frequency range 750 GHz to 1.1 THz, showing excellent agreement with prior work. A statistical analysis of uncertainty is performed, which demonstrates the robustness of our method.
Citation
Hammler, J., Gallant, A., & Balocco, C. (2015). Simple de-embedding and simulation technique to find permittivity with a THz vector network analyser. In 40th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 23-28 August 2015, Hong Kong (1-2). https://doi.org/10.1109/irmmw-thz.2015.7327822
Conference Name | 2015 40th International Conference on Infrared, Millimeter, and Terahertz waves (IRMMW-THz) |
---|---|
Conference Location | Hong Kong, China |
Start Date | Aug 23, 2015 |
End Date | Aug 28, 2015 |
Acceptance Date | Aug 23, 2015 |
Publication Date | Aug 23, 2015 |
Deposit Date | Dec 7, 2015 |
Publicly Available Date | Jan 26, 2016 |
Publisher | Institute of Electrical and Electronics Engineers |
Pages | 1-2 |
Series Title | IEEE Conference Proceedings |
Book Title | 40th International Conference on Infrared, Millimeter, and Terahertz Waves (IRMMW-THz), 23-28 August 2015, Hong Kong. |
DOI | https://doi.org/10.1109/irmmw-thz.2015.7327822 |
Keywords | Frequency measurement, Permittivity, Permittivity measurement, Scattering parameters, Semiconductor device measurement, Thickness measurement. |
Additional Information | Date of Conference: 23-28 August 2015 |
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