Surface micromachined membranes for wafer level packaging

Gallant, A.J.; Wood, D.

doi:10.1088/0960-1317/15/7/007

Surface micromachined membranes for wafer level packaging

Gallant, A.J.; Wood, D.

Authors

Professor Andrew Gallant a.j.gallant@durham.ac.uk
Professor

D. Wood

Abstract

Novel surface micromachined membranes have been developed for wafer level packaging and polymer encapsulation. Laterally unconstrained electroforming allows small etch holes to be included in thick membranes whilst only requiring a thin, low stress, mould. These holes have been shown to have a sufficiently small aperture (<10 µm) and depth (17 µm) to block a high viscosity encapsulant (AZ4562 photoresist). However, they enable the low viscosity sacrificial release etchant (acetone) to pass through. Etch hole inclusion provides a rapid and clean release. In order to route interconnect to the membranes, side port flow channels have been developed which effectively block spin-on encapsulants from entering the protected cavity. The influence of the membranes on the RF performance of micromachined meander inductors is reported.

Citation

Gallant, A., & Wood, D. (2005). Surface micromachined membranes for wafer level packaging. Journal of Micromechanics and Microengineering, 15(7), S47-S52. https://doi.org/10.1088/0960-1317/15/7/007

Journal Article Type	Article
Online Publication Date	Jun 20, 2005
Publication Date	Jul 1, 2005
Deposit Date	Jan 23, 2007
Journal	Journal of Micromechanics and Microengineering
Print ISSN	0960-1317
Electronic ISSN	1361-6439
Publisher	IOP Publishing
Peer Reviewed	Peer Reviewed
Volume	15
Issue	7
Pages	S47-S52
DOI	https://doi.org/10.1088/0960-1317/15/7/007
Keywords	Photoresist, MEMS, CHIP.