Gallant, A. J. and Wood, D. (2005) 'Surface micromachined membranes for wafer level packaging.', Journal of micromechanics and microengineering., 15 (7). S47-S52.
Novel surface micromachined membranes have been developed for wafer level packaging and polymer encapsulation. Laterally unconstrained electroforming allows small etch holes to be included in thick membranes whilst only requiring a thin, low stress, mould. These holes have been shown to have a sufficiently small aperture (<10 µm) and depth (17 µm) to block a high viscosity encapsulant (AZ4562 photoresist). However, they enable the low viscosity sacrificial release etchant (acetone) to pass through. Etch hole inclusion provides a rapid and clean release. In order to route interconnect to the membranes, side port flow channels have been developed which effectively block spin-on encapsulants from entering the protected cavity. The influence of the membranes on the RF performance of micromachined meander inductors is reported.
|Keywords:||Photoresist, MEMS, CHIP.|
|Full text:||Full text not available from this repository.|
|Publisher Web site:||http://dx.doi.org/10.1088/0960-1317/15/7/007|
|Date accepted:||No date available|
|Date deposited:||No date available|
|Date of first online publication:||20 June 2005|
|Date first made open access:||No date available|
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