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Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages

Tanner, B.K.; Danilewsky, A.N.; Vijayaraghavan, R.K.; Cowley, A.; McNally, P.J.

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Authors

A.N. Danilewsky

R.K. Vijayaraghavan

A. Cowley

P.J. McNally



Abstract

Transmission X-ray diffraction imaging in both monochromatic and white beam section mode has been used to measure quantitatively the displacement and warpage stress in encapsulated silicon devices. The displacement dependence with position on the die was found to agree well with that predicted from a simple model of warpage stress. For uQFN microcontrollers, glued only at the corners, the measured misorientation contours are consistent with those predicted using finite element analysis. The absolute displacement, measured along a line through the die centre, was comparable to that reported independently by high-resolution X-ray diffraction and optical interferometry of similar samples. It is demonstrated that the precision is greater than the spread of values found in randomly selected batches of commercial devices, making the techniques viable for industrial inspection purposes.

Citation

Tanner, B., Danilewsky, A., Vijayaraghavan, R., Cowley, A., & McNally, P. (2017). Nondestructive X-ray diffraction measurement of warpage in silicon dies embedded in integrated circuit packages. Journal of Applied Crystallography, 50(2), 547-554. https://doi.org/10.1107/s1600576717003132

Journal Article Type Article
Acceptance Date Feb 24, 2017
Online Publication Date Mar 22, 2017
Publication Date Apr 1, 2017
Deposit Date May 2, 2017
Publicly Available Date May 3, 2017
Journal Journal of Applied Crystallography
Print ISSN 0021-8898
Electronic ISSN 1600-5767
Publisher International Union of Crystallography
Peer Reviewed Peer Reviewed
Volume 50
Issue 2
Pages 547-554
DOI https://doi.org/10.1107/s1600576717003132

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Publisher Licence URL
http://creativecommons.org/licenses/by/4.0/

Copyright Statement
This is an open-access article distributed under the terms of the Creative Commons Attribution (CC-BY) Licence, which permits unrestricted use, distribution, and reproduction in any medium, provided the original authors and source are cited.





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