Skip to main content

Research Repository

Advanced Search

Temperature control to increase inter-layer bonding strength in fused deposition modelling

Kumrai-Woodruff, R.; Wang, Q.

Temperature control to increase inter-layer bonding strength in fused deposition modelling Thumbnail


Authors

R. Kumrai-Woodruff



Abstract

Fused Deposition Modelling (FDM) provides opportunities for new development in numerous areas. Z-directional anisotropic strength caused by weak inter-layer bonding has been recognized as the reason for limited industry adoption of FDM. This paper aims to investigate increasing the Z-directional strength of Acrylonitrile Butadiene Styrene (ABS) using a temperature controlled print environment. The ambient temperature during printing was increased to reduce heat transfer from the print, thereby encouraging more polymer chain inter-diffusion between layers. Dogbone specimens were printed at ambient print temperatures between 24.8°C and 71.2°C and tensile tests were performed. A thermal camera was used to identify heat loss in the FDM process. Ultimate tensile strength was found to increase by a maximum of 104% compared to open enclosure printing. A stylus profiler and scanning electron microscopy were used to compare the quality of the inter-layer bonds, suggesting that additional polymer inter-diffusion occurred at hotter ambient temperatures. A weak positive relationship was found between ambient air temperature and inter-layer part strength. Further experimentation could provide scope to determine an ideal ambient print temperature that is likely to be dependent on print settings and the printer used.

Citation

Kumrai-Woodruff, R., & Wang, Q. (2020). Temperature control to increase inter-layer bonding strength in fused deposition modelling. . https://doi.org/10.1115/detc2020-22342

Conference Name The ASME 2020 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference (IDETC/CIE2020)
Conference Location St. Louis, MO, USA
Start Date Aug 17, 2020
End Date Aug 19, 2020
Acceptance Date Mar 31, 2020
Online Publication Date Nov 3, 2020
Publication Date Nov 3, 2020
Deposit Date Dec 18, 2020
Publicly Available Date Jan 4, 2021
Publisher American Society of Mechanical Engineers
Volume Volume 6: 25th Design for Manufacturing and the Life Cycle Conference (DFMLC)
Pages DETC2020-22342, V006T06A002; 11 pages
Series Title International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
DOI https://doi.org/10.1115/detc2020-22342
Publisher URL https://asmedigitalcollection.asme.org/IDETC-CIE/proceedings-abstract/IDETC-CIE2020/83952/V006T06A002/1089908

Files





You might also like



Downloadable Citations