An isogeometric boundary element method for heat transfer problems of multiscale structures in electronic packaging with arbitrary heat sources

Abstract

We present an isogeometric boundary element method (IGABEM) capable of studying heat transfer problems for multiscale structures in electronic packaging problems. This method offers a number of key improvements compared with current analysis methods available for electronic packaging problems. The method benefits from the accuracy, computational efficiency and CAD integration that have consistently been shown as features of the IGABEM. In addition, the current method can efficiently evaluate the nearly singular integrals caused by multiscale structures, owing to the use of a proposed hybrid integration scheme. By changing a tolerance, the scheme enables engineers to achieve any desired balance between accuracy and computational efficiency as may be appropriate to the situation. To study heat transfer problems with an arbitrary heat source, the radial integral method is used to transform the domain integral to an equivalent boundary integral. Numerical results are compared with available analytical solutions and finite element solutions and demonstrate the effectiveness of the proposed approach.